IC Package Types and Their Features

In their daily work, electronic engineers frequently encounter various types of integrated circuits (ICs), such as logic chips, memory chips, microcontrollers (MCUs), or field-programmable gate arrays (FPGAs). While engineers may have a good understanding of the functional characteristics of these ICs, they may not be familiar with the concept of IC packaging.

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In this article, I will delve into different types of integrated circuit packaging, discussing their features, images, pins, and more. I hope this will help you gain a deeper understanding of the various types of integrated circuit packaging.

 

What is Integrated Circuit Packaging?

Integrated circuit packaging involves placing one or more integrated circuit chips within specific packaging materials to provide protection, mechanical support, and electrical connections. Packaging entails encapsulating bare chips within a casing to ensure their stability and reliability in practical applications.

 

IC Package serves not only to install, secure, and seal the chips for physical protection and enhanced thermal performance but also to provide connection pins for the circuit. These pins are then connected to other components through traces on printed circuit boards, enabling the internal chips to interface with external circuits and establish connectivity with other electronic components.

 

Furthermore, integrated circuit packaging must adequately cater to the needs and advancements of electronic devices. Due to variations in functionality among different types of electronic equipment and instruments, their overall structures and assembly requirements often differ. Hence, integrated circuit packaging must be diverse enough to meet the needs of various devices.

 

IC Package evolves alongside the development of integrated circuits. With the continuous progress in aerospace, aviation, machinery, light industry, and chemical engineering, overall systems are trending towards multifunctionality and miniaturization.

 

Consequently, there is an increasing demand for higher integration levels and more complex functionalities in integrated circuits. Correspondingly, packaging density must increase, the number of leads must grow, while the size, weight, and rate of technological advancement should decrease. Packaging structures' rationality and scientific nature will directly impact the quality of integrated circuits.

 

The Role of IC Packages

IC packages serve not only to establish electrical connections between bonding points within the IC chip and the external world but also to provide a stable and reliable operating environment for the IC chip. They play a crucial role in mechanically protecting the IC chip and safeguarding it against environmental factors, thereby enabling the IC chip to function properly while ensuring high stability and reliability.

 

Although there are significant variations in the physical structure, application domains, and the number of I/Os of ICs, the purpose and functionality of IC packaging remain largely consistent. As the "protectors" of the chips, packages fulfill several key functions:

 

• Chip Protection: Packages safeguard chips from physical damage.

• I/O Redistribution: Packages allow for reconfiguring I/Os, achieving more manageable pin spacing during assembly.

• Standardized Structure: Packages provide standardized structures that facilitate heat dissipation and prevent soft errors caused by alpha particles.

• Convenient Testing and Aging: Packages offer structures conducive to testing and ageing experiments.

Packaging can also facilitate interconnection between multiple ICs by employing standard interconnection techniques such as wire bonding.

 

Furthermore, packaging provides interconnection pathways used indirectly in various methods, including hybrid packaging, multi-chip modules (MCM), system-in-package (SiP), and other approaches encompassed by the concepts of miniaturization and interconnection of systems (VSMI).

 

With the continuous development of Micro-Electro-Mechanical Systems (MEMS) devices and Lab-on-a-Chip devices, packaging assumes additional roles:

 

• Restricting Chip-External Interactions: Packages limit the chip's interaction with the external environment.

• Meeting Pressure Differential Requirements: Packages meet specific pressure differential requirements.

• Meeting Chemical and Atmospheric Environment Requirements: Packages fulfill the demands of chemical and atmospheric environments.

 

Moreover, there is increasing focus and active involvement in the research of optoelectronic packaging to meet the evolving demands in this significant field.

 

In recent years, the perception of the importance and increasing functionality of IC packaging has undergone a significant transformation. IC packaging has become equally important as the IC itself, emerging as a crucial field in its own right.

 

Types of IC Packages - Common

Different IC packaging types possess distinct advantages and are suitable for specific applications. By selecting the appropriate packaging type, circuit requirements can be met, thereby enhancing the performance and reliability of integrated circuits.

 

Here are 10 common IC packaging types and their characteristics:

DIP (Dual In-line Package)

SOP (Small Outline Package)

QFP (Quad Flat Package)

BGA (Ball Grid Array)

LGA (Land Grid Array)

CSP (Chip Scale Package)

TO (Transistor Outline)

PLCC (Plastic Leaded Chip Carrier)

QFN (Quad Flat No-Lead)

SMD (Surface Mount Device)

 

DIP (Dual In-line Package)

A dual in-line package (DIP) is one of the through-hole packaging types, with pins extending from both sides of the package. It is available in two materials: plastic and ceramic. 

 

DIP is the most commonly used through-hole package and finds application in standard logic ICs, memory LSIs, microcircuits, and more. The pin pitch is 2.54mm, with pin counts ranging from 6 to 64. 

 

The package width is typically 15.2mm. Some packages with widths of 7.52mm and 10.16mm are referred to as "skinny DIP" and "slim DIP", respectively, although in most cases, they are simply referred to as DIP. Ceramic DIP sealed with low-melting-point glass is also known as the card.

Features

• Pins on both sides: The pins of DIP packages are arranged in a dual-column format on both sides of the package. This arrangement makes it easier to handle DIP packages during insertion into sockets or to solder onto circuit boards.

• Suitable for larger-sized integrated circuits: DIP packages are typically used for larger-sized integrated circuit chips as they provide ample space to accommodate more pins.

• Easy manual insertion and removal: Due to the pins of DIP packages being located on both sides of the package, they can be easily inserted or removed from sockets by hand. This facilitates convenience during chip repairs or replacements.

• Relatively lower pin density: Compared to some modern packaging types, DIP packages have a lower pin density. This means that they may require more space in compact circuit designs.

 

Although DIP packages are less commonly used in modern electronic devices, they still find wide adoption in certain applications, particularly those requiring manual insertion/removal or larger-sized chips.

 

SOP (Small Outline Package)

A small outline package (SOP) is one of the surface-mount packaging types, with pins extending from both sides of the package in the shape of seagull wings (L-shape). It is available in two materials: plastic and ceramic. It is also known as Small Outline Package (SOL) or Dual Flat Package (DFP).

 

In addition to being used for memory LSIs, SOP is widely employed in circuits such as moderately sized Application Specific Standard Products (ASSP). In the domain of input and output terminals ranging from 10 to 40, SOP is the most commonly used surface-mount package. It has a pin pitch of 1.27mm, with a pin count ranging from 8 to 44.

 

Furthermore, SOP with a pin pitch smaller than 1.27mm is referred to as Small Shrink Outline Package (SSOP). SOP with an assembly height of less than 1.27mm is known as a Thin Small Outline Package (TSOP) (see SSOP, TSOP). There is also a variant of SOP that includes a heat sink.

Features

• Compact size: SOP packaging is designed to be compact, allowing for high-density component placement within limited space. This makes it suitable for applications with restricted space.

• Low profile: SOP packaging has a low profile, meaning it has a small vertical height above the printed circuit board (PCB). This feature is beneficial for applications with height limitations or a need for slim designs.

• Surface mount: SOP packages utilize surface-mount technology, enabling direct soldering onto the surface of the PCB and providing reliable electrical connections. This packaging form facilitates automated production and efficient assembly processes.

SOP packaging finds extensive application in consumer electronics, communication devices, computer hardware, and other fields. It plays a vital role in miniaturization and high-performance solutions for electronic devices.

 

QFP (Quad Flat Package)

Quad Flat Package (QFP) is a surface-mount type of package with a flattened profile and pins extending from all four sides in a seagull-wing (L) shape. It can be fabricated using three main substrate materials: ceramic, metal, and plastic, with plastic encapsulation being the most prevalent in terms of quantity. In cases where the material is not explicitly specified, plastic QFP is commonly assumed.

 

Plastic QFP is the most widely used multi-pin LSI (Large Scale Integration) package. It finds application not only in digital logic LSI circuits such as microprocessors and gate arrays but also in analogue LSI circuits for VTR signal processing, audio signal processing, and similar applications.

 

QFP packages come in various pin pitch specifications, including 1.0mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, and 0.3mm. The 0.65mm pitch specification typically supports a maximum pin count of 304.

 

In Japan, QFP packages with a pin pitch smaller than 0.65mm are referred to as QFP(FP). However, the Japan Electronic and Mechanical Industries Association has recently reassessed the external specifications of QFP. Instead of distinguishing based on pin pitch, they now classify the packages into three types based on the package body thickness: QFP (2.0mm to 3.6mm thick), LQFP (1.4mm thick), and TQFP (1.0mm thick).

 

Additionally, some LSI manufacturers specifically designate QFP packages with a 0.5mm pin pitch as Shrink Quad Flat Package (SQFP) or VQFP.

 

However, some manufacturers also use the term SQFP for QFP packages with pin pitches of 0.65mm and 0.4mm, causing some degree of confusion.

 

One drawback of QFP packages is that when the pin pitch is less than 0.65mm, the pins are prone to bending. To mitigate pin deformation, several improved variants of QFP have been developed:

 

• BQFP, which features tree-shaped buffing pads at the package corners.

• GQFP, which includes resin protection rings covering the front end of the pins.

• TPQFP, which incorporates test protrusions within the package body, allows testing with dedicated fixtures to prevent pin deformation.

Features

• High pin density: QFP packages are designed to accommodate a large number of pins, making them suitable for complex circuits with numerous connections.

• Good heat dissipation: QFP packages typically have exposed thermal pads or pins on the bottom, facilitating efficient heat dissipation for ICs that generate substantial heat during operation.

• Convenient assembly: Due to their standardized design and flat bottom surface, QFP packages are well-suited for automated assembly processes. The pins can be easily soldered onto PCBs using surface mount technology (SMT), enabling efficient and cost-effective production.

• Versatility: QFP packages are available in various sizes and pin configurations, offering flexibility to meet the requirements of different designs and applications. They are widely used in computer peripherals, consumer electronics, communication devices, automotive systems, and other electronic devices.

 

QFP packages strike a balance between pin count, space efficiency, and assembly convenience, making them highly favored in many IC applications.

 

BGA (Ball Grid Array)

Ball Grid Array (BGA) is a surface-mount packaging technique that utilizes a spherical contact display. It involves the creation of spherical protrusions on the backside of a printed circuit board (PCB) to replace conventional pins. LSI chips are mounted on the front side of the PCB and then sealed using either transfer molding resin or encapsulation methods. BGA is also referred to as the Protrusion Array Carrier (PAC).

 

BGA is a packaging solution commonly employed in multi-pin LSIs, offering the possibility of exceeding 200 pins. The package itself can be smaller in size compared to Quad Flat Package (QFP), for instance.

 

For example, a 360-pin BGA with a pin pitch of 1.5mm occupies only 31mm on each side, while a 304-pin QFP with a pin pitch of 0.5mm requires 40mm on each side.

 

Furthermore, BGA eliminates concerns about pin deformation that are present in QFP packages.

 

Initially developed by Motorola in the United States, BGA was first adopted in portable telephones and other devices. It is expected to become more prevalent in personal computers in the future.

 

Initially, BGA had a pin pitch of 1.5mm and featured 225 pins. Presently, some LSI manufacturers are developing 500-pin BGAs.

 

One challenge with BGA is post-reflow appearance inspection. Effective methods for visual inspection are currently unclear.

 

Some argue that due to the larger pitch of the solder joints, the connections can be considered stable and can only be addressed through functional testing. Motorola refers to the resin-sealed package as OMPAC and the encapsulation-sealed package as GPAC.

Features

• High Density: BGA packaging accommodates a higher number of pins by arranging solder balls in a grid pattern that covers the bottom of the package. This makes BGA suitable for high-density integrated circuits, allowing for more pins in a smaller package size.

• Excellent Electrical Performance: The reliable solder connections between the solder balls and the printed circuit board (PCB) result in low resistance and low inductance electrical connections, thereby enhancing signal transmission and electrical performance.

• Low Inductance: The grid arrangement of solder balls reduces the transmission path between pins, minimizing inductance effects and facilitating the transmission of high-frequency signals while reducing signal noise.

• Good Thermal Dissipation: BGA packages often incorporate bottom metal heat pads or heat balls, effectively conducting and dissipating generated heat, thereby improving the thermal dissipation performance of the integrated circuits.

• Reliability: The grid arrangement of solder balls enhances BGA packages' resistance to mechanical stress and vibration, providing a more reliable connection and reducing issues such as pin breakage and cold soldering.

• Versatility: BGA packages are suitable for various types of integrated circuits, including processors, FPGAs, ASICs, etc. They find wide-ranging applications in computers, communication equipment, consumer electronics, and other fields.

 

BGA packaging has gained popularity due to its high density, excellent electrical performance, thermal dissipation capabilities, and reliability. It has become one of the most common packaging types in modern electronic devices.

 

LGA (Land Grid Array)

Land Grid Array. It refers to the packaging that incorporates an array of electrode contacts on the bottom surface. It can be easily inserted into a socket during assembly. Currently, ceramic LGAs with 227 contacts (1.27mm pitch) and 447 contacts (2.54mm pitch) are being practically used in high-speed logic LSI circuits.

 

Compared to QFP, LGA can accommodate more input and output pins in a relatively smaller package. Additionally, its low impedance leads make it highly suitable for high-speed LSIs. However, due to the complexity and high cost involved in socket production, LGA is currently not widely used. Nevertheless, it is expected that the demand for LGA will increase in the future.

Features

• Pad array configuration: LGA packaging employs an ordered arrangement of pads on the bottom surface. These pads provide more electrical connection points compared to traditional pin packages.

• High-density interconnects: The design of pad arrays enables LGA packages to achieve higher pin densities, making them suitable for complex integrated circuits requiring a large number of pins.

• Reliable electrical connections: The pads offer reliable electrical connections, ensuring stable and dependable signal transmission between the package and the PCB.

• Thermal performance: LGA packages typically exhibit good heat dissipation characteristics. The metal contact between the pads and the PCB efficiently transfers the heat generated inside the package.

• Wide applicability: LGA packaging finds extensive use in high-performance processors, graphics processors (GPUs), chipsets, and other integrated circuit products that demand high pin densities and efficient heat dissipation.

 

The key features of LGA packaging, including high pin density, reliable electrical connections, and excellent thermal performance, make it the most prevalent type of integrated circuit packaging in modern electronic devices.

 

CSP (Chip Scale Package)

Chip Scale Package(CSP) is characterized by its compact size, which closely matches the dimensions of the integrated circuit chip. CSP achieves high integration and miniaturization by minimizing the size of the package.

Features

• Ultra-small size: CSP packages have extremely small dimensions, approaching those of the integrated circuit chip. This reduction in package size minimizes the space occupied, allowing for a more compact circuit layout on the circuit board, thus facilitating high-density circuit designs.

• High integration: Due to the close proximity in size to the chip, CSP enables highly integrated circuit designs. Multiple CSP-packaged chips can accommodate more functionalities and circuit components within a smaller space.

• Low power consumption: CSP packaging typically employs surface mount technology, which reduces power losses in signal transmission by utilizing short-distance signal transfer and tight connections between the package and the circuit board.

• Excellent electrical performance: CSP packaging utilizes short-distance electrical connections and wiring, minimizing adverse effects such as resistance, inductance, and capacitance, thereby providing excellent electrical performance.

• Facilitates automated production: CSP packaging is well-suited for large-scale automated production. Through advanced production equipment, efficient packaging processes can be realized, thereby enhancing production efficiency and product quality.

 

CSP packaging, due to its ultra-small size, high integration, low power consumption, and excellent electrical performance, finds wide application in integrated circuit products for fields such as mobile devices, wireless communications, consumer electronics, and medical devices.

 

TO (Transistor Outline)

TO (Transistor Outline) is a type of transistor package primarily used for discrete transistor encapsulation. It is a standardized packaging type with a specific appearance and pin layout.

 

The TO package typically has a cylindrical or rectangular shape with protruding pins. It is a through-hole package and is usually connected to the circuit board through soldering or insertion.

 

The TO package plays a crucial role in protecting and mechanically supporting the transistor. It provides a physical barrier between the external environment and the transistor chip, safeguarding the transistor from mechanical stress, dust, moisture, and other environmental factors.

 

Additionally, the TO package facilitates electrical connections through the pin connections, allowing the transistor's signals and power to be extracted and enabling interaction with other circuit components or systems.

 

TO packages are typically numbered based on pin count and package size, such as TO-92, TO-220, etc. Each type of TO package has specific pin layouts and size specifications to accommodate different types of transistors. 

 

They often possess certain heat-resistant properties to meet the heat dissipation requirements of high-power transistors.

Features

• Standardized Packaging: The TO package is a standardized packaging type with a uniform appearance and pin layout. This standardization allows TO-packaged transistors to be widely used in different circuit designs, facilitating production and usage.

• Mechanical Support: The TO package provides mechanical support and protection for the transistor. It withstands external mechanical stress and environmental factors, enhancing the stability and reliability of the transistor.

• Pin Connections: The TO package utilizes pin connections to extract the transistor's signals and power, enabling connection with other circuit components or systems. The pin layout and count may vary depending on the package type.

• Heat Resistance: TO packages generally possess a certain level of heat resistance to meet the heat dissipation requirements of high-power transistors. They can operate stably within a specific temperature range and achieve heat dissipation through a pin and contact area.

• Through-Hole Package: TO packages belong to the through-hole package type and are typically connected to the circuit board through soldering or insertion. This connection method is relatively simple, facilitating manufacturing and maintenance.

 

PLCC (Plastic Leaded Chip Carrier)

The Plastic Leaded Chip Carrier (PLCC) is a type of surface-mount package that serves as a chip carrier for electronic components. It features leads that extend from all four sides of the package, forming a cruciform shape. The package itself is made of plastic.

Initially introduced by Texas Instruments in 64k-bit and 256k-bit DRAMs, the PLCC has now become popular for logic LSI, DLD (or programmable logic devices), and other circuits.

 

The pin pitch of PLCC is 1.27mm, with pin counts ranging from 18 to 84. Its J-shaped pins are less prone to deformation compared to Quad Flat Package (QFP), making it easier to handle. However, visual inspection after soldering can be more challenging.

 

PLCC is similar to LCC (also known as QFN). In the past, the main distinction was that PLCC utilized plastic while LCC employed ceramic materials. However, variations have emerged, such as ceramic J-shaped pin packages and pinless plastic packages (referred to as Plastic LCC, PC LP, P-LCC, etc.), making it difficult to differentiate between the two.

 

To address this, the Japan Electronic Machinery Industry Association decided in to refer to the package with J-shaped pins extending from all four sides as QFJ and the package with electrode bumps on all four sides as QFN.

Features

• Leaded Package: PLCC employs a leaded package design featuring multiple pins arranged around the periphery of the package. The number and arrangement of pins may vary depending on the specific package specifications.

• Plastic Material: The PLCC package is made of plastic material, typically thermoplastic. This material offers excellent insulation properties, lightweight construction, low cost, and ease of manufacturing and processing.

• Inverted Package: The chip in a PLCC package is typically positioned inside the package and connected to the exterior via leads. This design provides improved electrical connectivity and mechanical support while reducing the risk of chip damage during installation.

• Thermal Dissipation: PLCC packages generally exhibit good thermal dissipation properties, effectively transferring heat generated by the chip to the exterior of the package, thereby maintaining stable operating temperatures for the chip.

• Removability: PLCC packages can usually be detached from the chip carrier through methods like hot air reflow or other techniques, facilitating chip replacement or repair when needed.

• Widespread Application: Due to its reliability, ease of use, and cost-effectiveness, PLCC packaging finds extensive application in various electronic devices, including computers, communication equipment, and consumer electronics.

 

PLCC packaging encompasses features such as leaded design, plastic material construction, inverted packaging, good thermal dissipation, removability, and wide-ranging applications. These characteristics make PLCC a common and dependable chip package suitable for diverse electronic applications.

 

QFN (Quad Flat No-Lead)

Quad Flat No-Lead (QFN) is a type of surface-mount package and is also commonly referred to as LCC (Leadless Chip Carrier). The term QFN is defined by the Japan Electronic and Mechanical Industries Association. 

 

The package features electrode contact points on all four sides and does not have external leads. Compared to Quad Flat Package (QFP), QFN occupies a smaller surface area and has a lower height. However, the lack of leads in QFN makes it challenging to alleviate stress between the printed circuit board and the package at the points of the electrode contact.

 

As a result, the electrode contact points in QFN are generally fewer in number compared to the pins in QFP, typically ranging from around 14 to 100. There are two material options: ceramic and plastic. When labeled as LCC, it usually refers to ceramic QFN. The center-to-center spacing of the electrode contact points is 1.27mm.

 

Plastic QFN is a cost-effective package that uses glass epoxy resin as the substrate for the printed circuit board. In addition to the 1.27mm center-to-center spacing, there are also two other options: 0.65mm and 0.5mm. This package is also known as plastic LCC, PCLC, or P-LCC.

Features

• Leadless Design: QFN packages employ a leadless design, with the pins typically located on the bottom of the package, not exposed around the package's perimeter. This design helps save space and increase package integration.

• Package Shape: QFN packages are usually square or rectangular, with typically flat edges. The dimensions can be adjusted according to specific requirements to accommodate different chip sizes and pin counts.

• Pad Connection: QFN packages use pads for connection to the circuit board. The pads are usually located on the bottom of the package and are connected to the circuit board's pads through soldering techniques such as solder balls or solder paste. This enables electrical connection and mechanical support.

• Low Delay and Low Inductance: Due to the direct connection of the QFN package's pads to the metal pads on the circuit board, it exhibits lower inductance and delay, which benefits high-frequency signal performance and circuit response speed.

• Heat Dissipation: QFN packages typically offer good heat dissipation capabilities. The pads on the package's bottom can serve as heat-conducting surfaces, effectively transferring heat generated by the chip to the circuit board or heat dissipation system, enhancing the chip's thermal management.

• Compact Size: With the leadless design, QFN packages have smaller dimensions compared to traditional leaded packages, facilitating compact circuit board layouts and high-density integration.

• High Reliability: QFN packages achieve stable electrical and mechanical connections through pad connections, providing reliable packaging and protection. They can maintain chip performance and stability even in harsh operating environments.

 

QFN packages possess characteristics such as leadless design, square or rectangular shape, pad connections, low delay and inductance, good heat dissipation, compact size, and high reliability. 

 

These features make QFN a common and suitable chip package for various application fields, including communication equipment, consumer electronics, automotive electronics, and more.

 

SMD (Surface Mount Device)

SMD (Surface Mount Device) is a type of surface-mount component, also known as a surface-mount element. Unlike traditional through-hole components, the pins of SMD devices are directly soldered onto the surface of a printed circuit board (PCB) without the need for insertion through holes.

 

The pins of SMD devices are typically flat, small metal pads or spherical solder balls, which are soldered to corresponding pads on the PCB, achieving electrical connections and mechanical fixation. This surface-mount design makes component installation more convenient, fast, and automated, thereby enhancing production efficiency and reliability.

Features

• Compact Size: SMD devices are smaller in size compared to traditional through-hole devices, enabling high integration and compact circuit design. This is particularly important for electronic devices that require miniaturization.

• High Integration: Due to the surface-mount technology employed in SMD devices, more functionality and components can be integrated within relatively small spaces, providing higher integration and performance.

• Lightweight: The small size and lightweight materials of SMD devices contribute to overall low weight, catering to the demands of slimness and portability.

• Low Power Consumption: SMD devices typically utilize advanced semiconductor manufacturing processes, exhibiting low power consumption characteristics that contribute to improved energy efficiency and battery life.

• High-Frequency Characteristics: SMD devices possess excellent high-frequency characteristics, making them suitable for high-frequency signal processing and communication applications.

• Automated Production: The surface-mount nature of SMD devices lends itself to automated production processes, enabling high-speed and high-precision assembly processes, thereby improving production efficiency and quality control.

• Reliability: With robust soldered connections to the PCB, SMD devices exhibit high mechanical strength and reliability, capable of withstanding environmental factors such as vibration, impact, and temperature variations.

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Types of IC Packages - ALL

Please find below a list of IC package types and their characteristics for your reference:

 

BGA (Ball Grid Array)  

- Pins arranged in a grid of solder balls on the package bottom, providing high pin density and connectivity

- Suitable for high-speed and high-density applications with good thermal dissipation

BQFP (Quad Flat Package with Bumper)  

 - Flat package with additional bumpers on the corners for improved durability and protection

 

C-PGA (Ceramic Pin Grid Array)  

 - Ceramic package with pins arranged in a grid for enhanced mechanical strength and electrical performance

 

C- (Ceramic)    

- Ceramic package providing excellent thermal properties and high reliability

 

Cerdip    

- Ceramic Dual Inline Package with pins extending from the bottom of the package

 

Cerquad  

- Ceramic Quad Flat Package with pins extending from all four sides

 

CLCC (Ceramic Leaded Chip Carrier)    

- Ceramic package with metal leads for improved electrical performance and reliability

 

COB (Chip on Board)    

- Integrated circuit directly mounted on a PCB substrate, reducing package size and improving electrical performance

 

DFP (Dual Flat Package)  

- Flat package with pins on two opposite sides, suitable for space-constrained applications

 

DIL (Dual In-Line)    

- Package with pins on two parallel sides, commonly used for through-hole mounting

 

DIP (Dual In-Line Package)  

- Classic through-hole package with pins on two parallel sides

 

DSO (Dual Small Outline)    

- Compact package with pins on two adjacent sides, ideal for space-limited applications

 

DICP (Dual Inline Ceramic Package)    

- Ceramic package with pins on two parallel sides, providing excellent thermal and electrical properties

 

DTC (Dual Tape Carrier Package)    

- Package with pins extending from a tape carrier, facilitating automated assembly and handling

 

FP (Flat Package)  
- Flat package with pins extending from the sides or bottom, suitable for low-profile applications

 

Flip-Chip  
- Integrated circuit flipped and directly bonded to the substrate, allowing for high pin density and shorter interconnects

 

FQFP (Fine Pitch Quad Flat Package)  
- Quad flat package with reduced pin pitch for increased pin density and improved electrical performance

 

CPAC (Globe Top Pad Array Carrier)   
- Package with a dome-shaped top surface and an array of pads for high-density interconnections

 

CQFP (Quad Flat Package with Guard Ring)  
- Quad flat package with an additional guard ring for improved electromagnetic compatibility and thermal dissipation

 

H- (with heat sink)  
- Package designed with a built-in heat sink or thermal management features for improved heat dissipation

 

Pin Grid Array (Surface Mount Type)  
- Pins arranged in a grid pattern for surface mount applications, providing high pin density and compact size

 

JLCC (J-Leaded Chip Carrier)   
- Package with J-shaped leads for surface mount applications, offering improved electrical performance

 

LCC (Leadless Chip Carrier)  
- Package without external leads, allowing for high-density integration and reduced package size

 

LGA (Land Grid Array)  
- Pins arranged in a grid pattern on the package bottom, offering high pin density and reliable electrical connections

 

LOC (Lead on Chip)  
- Package with leads directly bonded to the chip, reducing parasitic inductance and enabling high-frequency applications

 

LQFP (Low Profile Quad Flat Package)  
- Quad flat package with reduced height for space-constrained applications

 

L-QUAD   
- Package with leads extending from all four sides, allowing for easy assembly and electrical connections

MCM (Multi-Chip Module)   
- Package incorporating multiple integrated circuits within a single module, enabling high integration levels

 

MFP (Mini Flat Package)  
- Compact flat package with small dimensions, suitable for miniaturized applications

 

MQFP (Metric Quad Flat Package)  
- Quad flat package with metric pitch for increased pin density and efficient PCB layout

 

MQUAD (Metal Quad)   
- Package with metal leads extending from all four sides, providing enhanced mechanical and electrical properties

 

MSP (Mini Square Package)  
- Small square-shaped package with leads extending from the sides, suitable for space-limited applications

 

OPMAC (Over Molded Pad Array Carrier)   
- Package with a protective overmold and pad array for robustness and easy integration

 

P- (Plastic)   
- Plastic package providing cost-effective and lightweight solutions for a wide range of applications

 

PAC (Pad Array Carrier)   
- Package with an array of pads for high-density interconnections, facilitating advanced packaging techniques

 

PCLP (Printed Circuit Board Leadless Package)  
- Leadless package directly mounted on a PCB for enhanced electrical performance and miniaturization

 

PFPF (Plastic Flat Package)  
- Flat package with plastic body and leads extending from the sides, offering versatility and ease of handling

 

PGA (Pin Grid Array)   
- Pins arranged in a grid pattern for through-hole mounting, providing reliable electrical connections

 

Piggy Back   
- Package mounted on top of another package, enabling stacked configurations and increased functionality

 

PLCC (Plastic Leaded Chip Carrier)   
- Plastic package with metal leads for improved electrical performance and ease of assembly

 

P-LCC (Plastic Leaded Chip Carrier)  
- Plastic package without external leads, offering high-density integration and reduced package size

 

QFH (Quad Flat High Package)  
- Quad flat package with increased height for accommodating taller components

 

QFI (Quad Flat I-Leaded Package)   
- Quad flat package with I-shaped leads, providing enhanced mechanical strength and electrical performance

 

QFJ (Quad Flat J-Leaded Package)   
- Quad flat package with J-shaped leads for improved electrical performance and heat dissipation

 

QFN (Quad Flat No-Lead Package)   
- Package with no leads extending from the sides, allowing for high pin density, compact size, and improved electrical performance

 

QFP (Quad Flat Package)   
- Flat package with pins extending from the sides, suitable for a wide range of applications

 

QFP (FP) (QFP Fine Pitch)   
- Quad flat package with fine pitch for increased pin density and improved electrical performance

 

QIC (Quad In-Line Ceramic Package)  
- Ceramic package with pins on four sides, offering excellent thermal properties and electrical performance

 

QIP (Quad In-Line Plastic Package)   
- Plastic package with pins on four sides, providing cost-effective and versatile solutions

 

QTCP (Quad Tape Carrier Package)  
- Package with a tape carrier for high-density interconnections, offering efficient assembly and handling

 

QTP (Quad Tape Carrier Package)   
- Package with a quad tape carrier for compact size and ease of integration

 

QUIL (Quad In-Line)  
- Package with leads extending from all four sides, providing ease of assembly and electrical connections

 

QUIP (Quad In-Line Package)  
- Package with leads extending from all four sides for improved electrical performance and heat dissipation

 

SDIP (Shrink Dual In-Line Package)   
- Dual in-line package with reduced size for space-constrained applications

 

SH-DIP (Shrink Dual In-Line Package)  
- Dual in-line package with shrink size and improved electrical performance

 

SIL (Single In-Line)   
- Package with a single row of leads, suitable for low-pin count applications

 

SIMM (Single In-Line Memory Module)   
- Package for memory modules with a single row of leads, enabling memory integration

 

SIP (Single In-Line Package)   
- Package with a single row of leads for compact size and easy integration

 

SK-DIP (Skinny Dual In-Line Package)  
- Dual in-line package with a slim profile for space-saving applications

 

SL-DIP (Slim Dual In-Line Package)  
- Dual in-line package with a slim profile for space-efficient assembly

 

SMD (Surface Mount Devices)  
- Devices designed for surface mount applications, offering space-saving, automated assembly capabilities

 

SO (Small Outline)  
- Package with a small and compact outline for space-constrained applications

 

SOI (Small Outline I-Leaded Package)  
- Small outline package with I-shaped leads, providing improved mechanical strength and electrical performance

 

SOIC (Small Outline Integrated Circuit)  
- Small outline package for integrated circuits, offering space-saving and reliable electrical connections

 

SOJ (Small Outline J-Leaded Package)  
- Small outline package with J-shaped leads, providing enhanced electrical performance and heat dissipation

 

SQL (Small Outline L-Leaded Package)  
- Small outline package with L-shaped leads, offering improved electrical performance and ease of assembly

 

SONF (Small Outline Non-Fin)  
- Small outline package without fins, suitable for compact and low-profile applications

 

SOF (Small Outline Package)   
- Small outline package with compact size and versatile applications

 

SOW (Small Outline Package - Wide Type)   
- Small outline package with wider dimensions for enhanced electrical performance and heat dissipation

 

COB (Chip On Board)  
- Package where the IC chip is directly mounted onto a PCB, providing compact integration and cost-effectiveness

 

COG (Chip on Glass)  
- Package where the IC chip is mounted directly on a glass substrate, offering high-density integration and compact size

Conclusion

With the maturity of chip technology and the rapid improvement of chip yield, the cost of back-end packaging has become increasingly significant in the overall integrated circuit cost. The ever-changing and rapidly developing packaging technologies are overwhelming.

 

It is our hope that this article will provide you with valuable insights, enabling you to gain a deeper understanding of integrated circuit packaging.

Read More:

Small Outline Integrated Circuit - SOIC

IC Package Types and Their Features

Small Outline Package (SOP): Definition, Applications and Advantages

What is a SMD Package? It's Features, Types and Sizes

Dual Inline Package Meaning

Whether you are moving at a high speed or you're designing a high-speed printed circuit board, good board design practices help ensure your design will work as intended and can be manufactured at volume. In this guide, we've compiled some of the essential PCB board design and layout guidelines that apply to most modern circuit boards. Specialty designs may need to follow additional board layout guidelines, but the PCB layout guidelines shown here are a good place to start for most board designs.

The guidelines shown here are focused on a few key areas that will help you with routing, manufacturability, basic signal integrity, and assembly:

When starting a new printed circuit board design, it&#;s sometimes easy to forget about the important design rules that will govern your project. There are some simple clearances that, if determined early in the design, will eliminate a lot of component shifting and re-routing later. So where can you get this information?

The first place to start is to talk to your PCB design rules fabrication house. A good fabricator will usually post their capabilities online or will supply this information in a document. If it's not in an obvious location on their website, send them an and ask for their capabilities. It's best to do this first before you start placing components. While you're at it, make sure to submit your proposed stack-up for review, or look for their standard stack-up data and use that.

Once you've found their list of capabilities, you should compare these to whatever industry reliability standard you'll work with (Class 2 vs. Class 3, or a specialty standard). Once these points are determined, you should select the more conservative design layout limits needed to ensure manufacturability and reliability, and you can encode these into your board design rules.

As you proceed through the layout process, your board design rules will help you eliminate most design errors that will lead to fabrication and assembly problems. After setting the board design rules, you can start the placement process.

The component placement stage of your PCB layout design process is both an art and a science, requiring a strategic consideration of the prime real estate available on your board. The goal in component placement is to create a board that can easily be routed, ideally with as few-layer transitions as possible. In addition, the design has to comply with the design rules and satisfy must-have component placements. These points can be difficult to balance, but a simple process can help a board designer place components that meet these requirements:

1. Place must-have components first. There are often components that must be placed in specific locations, sometimes due to mechanical enclosure constraints or due to their size. It's best to place these components first and lock in their position before proceeding to the rest of the layout.
2. Place large processors and ICs. Components like high pin count ICs or processors generally need to make connections to multiple components in the design. Locating these components centrally makes trace routing easier in the PCB layout.
3. Try to avoid crossing nets. When components are placed in the PCB layout, the unrouted nets are normally visible. It's best to try and minimize the number of crossing nets. Each net intersection will require a layer transition through vias. If you can eliminate net crossings with creative component placement, it will be easier to implement the best routing guidelines for a PCB layout.
4. SMD PCB board design rules. It&#;s recommended to place all surface mount device (SMD) components on the same side of the board. The main reason for this arises during assembly; each side of the board will require its own pass down the SMD soldering line, so placing all SMDs on one side will help you avoid some extra assembly costs. 
5. Experiment with orientation. It's okay to rotate components to try and eliminate net intersections. Try to orient connected pads so that they face each other as this can help simplify routing.

If you follow points #1 and #2, it's much easier to lay out the rest of your board without too much crossover between routes. In addition, your board will have that modern look and feel to the layout, where a central processor supplies data to all the other components around the perimeter of a board.

The main processor in this PCB layout design is centrally located with traces routed out from the edges. This is the ideal placement of larger ICs and peripherals.

With components placed, it&#;s now time to route power, ground, and signal traces to ensure signals have a clean and trouble-free path of travel. Here are some guidelines to keep in mind for this stage of your layout process:

It&#;s generally the case that power and ground are placed on two internal layers. For a 2-layer board, this might not be so easy, so you would want to place a large ground plane on one layer, and then route signals and power traces on the other layer. With 4-layer circuit board stack-ups and higher layer counts, you should use ground planes instead of trying to route ground traces. For components that need direct power connections, it&#;s recommended to use common rails for each supply if a power plane is not used; ensure you have wide enough traces (100 mils is fine for 5 to 10 A) and don't daisy chain power lines from part to part.

Some recommendations state that plane layer placement must be symmetrical, but this is not strictly required for manufacturing. In large boards, this might be needed to reduce the chances of warping, but this is not a concern in smaller boards. Focus on access to power and ground, as well as ensuring all traces have strong return path coupling to the nearest ground plane first, then worry about perfect symmetry in the PCB design stack-up.

Next up, connect your signal traces to match the nets in your schematic. PCB layout best practices recommend that you always place short, direct traces between components when possible, although this may not always be practical on larger boards. If your component placement forces horizontal trace routing on one side of the board, then always route traces vertically on the opposite side. This is one of many important 2-layer PCB board design rules.

Printed circuit board design rules and PCB layout guidelines become more complex as the number of layers in your stack-up increases. Your routing strategy will require alternating horizontal and vertical traces in alternating layers unless you separate each signal layer with a reference plane. In very complex boards for specialized applications, many of the commonly-touted PCB best practices may no longer apply, and you'll need to follow PCB board design guidelines that are particular to your application.

PCB layout designs use traces to connect components, but how wide should these traces be? The required trace width for different nets depends on three possible factors:

1. Manufacturability. Traces cannot be too thin, otherwise, they can't be reliably manufactured. In the majority of cases, you'll be working with trace widths that are much larger than the minimum value your fabricator can produce.
2. Current. The current carried in a trace will determine the minimum required width to prevent the trace from overheating. When the current is higher, the trace will need to be wider.
3. Impedance. High-speed digital signals or RF signals will need to have a specific trace width to hit a required impedance value. This doesn't apply to all signals or nets, so you don't need to enforce impedance control on every net in your board design rules.

For traces that don't need specific impedance or high current, a 10 mil trace width is fine for the vast majority of low-current analog and digital signals. Printed circuit board traces that carry more than 0.3 A may need to be wider. To check this, you can use the IPC- nomograph to determine your PCB design trace width for a required current capacity and temperature rise limit.

Preferred routing (arrows indicate component shifting direction)

 

Non-preferred routing (arrows indicate component shifting direction)

The ground plane can act as a large heat sink that then transports heat evenly throughout the board. Therefore, if a particular via is connected to a ground plane, omitting the thermal relief pads on that via will allow heat to conduct to the ground plane. This is preferable to keeping heat trapped near the surface. However, this can create a problem if through-hole components are assembled on the board using wave soldering as you need to keep heat trapped near the surface.

Thermal reliefs are one PCB layout design feature that might be needed to ensure a board will be manufacturable in a wave soldering process, or in other words, for through-hole components connected directly to planes. Because it can be difficult to maintain process temperatures when a through-hole is a solder point directly to a plane, it&#;s recommended thermal reliefs be used to ensure the soldering temperature can be maintained. The idea behind thermal relief is simple: it slows the rate at which heat is dissipated into the plane during soldering, which will help prevent cold joints.

 

The typical thermal relief pattern

Some designers will tell you to use a thermal relief pattern for any via or hole that is connected to an internal ground or power plane, even if it is just a small polygon. This advice is often overgeneralized. The need for a thermal via on any through-hole component will depend on the size of the copper plane or polygon that will make a connection on the internal layer, and it is something you should request your fabricator review before you place your board into production.

Through-hole pads on copper pour could require the same thermal pad application as planes. When the pour is very large, it starts to look a lot like a plane, and so a thermal pad should naturally be applied if a through-hole pin will be soldered into that connection.

For SMD parts, this is not always the case. Whether the thermal gets applied to the pour region depends on how the PCB will be assembled. A reflow soldering process will heat up the board uniformly as the device passes through the reflow oven, so the potential form tombstoning is much lower for those SMD pads, regardless of the presence of a thermal connection.

If the design will be assembled by hand, such as with solder paste and a heat gun, then the PCB layout might need thermals to trap enough heat near the pad and prevent tombstoning. When soldering by hand, it can be difficult to maintain consistent heating across the component leads, and a thermal connection can help prevent a tombstoning defect.

Thermal connection on a polygon in Altium Designer.

By default, Altium Designer will maintain thermal connections onto polygons when you create a new project. This is configured using the Polygon Connect rule in the PCB design rules editor. You can change this setting to apply based on specific footprints, layers, component classes, nets/net classes, or any other conditions using the query language in Altium Designer.

There are some routing guidelines for PCB design rules about how to group and separate components and traces so that you ensure easy routing while preventing electrical interference. These grouping guidelines can also help with thermal management as you might need to separate high-power components.

Some components are best placed in the PCB layout design by grouping them in one area. The reason is that they might be part of a circuit and they may only connect to each other, so there would be no need to place the components on different sides or areas of the board. PCB layout then becomes an exercise in designing and laying out individual groups of circuitry so that they can be easily connected together with traces.

In many layouts, you'll have some analog and some digital components, and you should prevent the digital components from interfering with the analog components. The way this was done decades ago was to split up ground and power planes into different regions, but this is not a valid design choice in modern board designs. Unfortunately, this is still communicated in many board layout guidelines and it leads to many bad routing practices that create EMI.

Instead, use a complete ground plane below your components, and do not physically break the ground plane up into sections. Keep the analog components with other analog components operating at the same frequency. Also, keep the digital components with other digital components. You can visualize this as having each type of component occupying a different region above the ground plane in the PCB layout design, but the ground plane should stay uniform in the majority of board designs.

Example of digital & analog sections in a PCB.

It is also appropriate to separate components that will dissipate a lot of heat on the board into different areas. The idea behind separating these high-power components is to equalize the temperature around the PCB layout, rather than to create large hotspots in the layout where high-temperature components are grouped. This can be accomplished by first finding the &#;thermal resistance&#; ratings in your component&#;s datasheet and calculating the temperature rise from the estimated heat dissipation. Heatsinks and cooling fans can be added to keep component temperatures down. You may have to carefully balance the placement of these components against keeping trace lengths short as you devise a routing strategy, which can be challenging.

It&#;s easy to get overwhelmed toward the end of your design project as you scramble to fit your remaining pieces together for manufacturing. Double and triple-checking your work for any errors at this stage can mean the difference between a manufacturing success or failure.

To help with this quality control process, it&#;s always recommended to start with your Electrical Rules Check (ERC) and Design Rules Check (DRC) to verify you&#;ve met all of your established constraints. With these two systems, you can easily define gap widths, trace widths, common manufacturing requirements, high-speed electrical requirements, and other physical requirements for your particular application. This automates PCB design layout review guidelines for validating your layout.

Note that many design processes state that you should run design rule checks at the end of the board design phase while preparing for manufacturing. If you use the right design software, you can run checks throughout the design process, which allows you to identify design potential problems early and correct them quickly. When your final ERC and DRC have produced error-free results, it&#;s then recommended to check the routing of every signal and confirm that you haven&#;t missed anything by running through your schematic one wire at a time.

There you have it - our top PCB layout guidelines that apply to most circuit board designs! Although the list of recommendations is short, this guideline can help you get well on your way toward designing a functional, manufacturable board in no time. These PCB board design guidelines only scratch the surface, but they form a foundation for building upon and solidifying a practice of continual improvement in all your design practices.

If you want to get started with the best PCB board design software with a built-in rules-driven design engine that helps you stay accurate, use the advanced design tools in Altium Designer®. When a design is finished and ready to be released to manufacturing, the Altium 365&#; platform makes it easy to collaborate and share your projects.

We have only scratched the surface of what&#;s possible with Altium Designer on Altium 365. Start your free trial of Altium Designer + Altium 365 today.

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Modern Interface Experience

&#;I had not been exposed to much 3D PCB design capability in the past. As a relatively new ALTIUM user I have to say that designing flexible and rigid PCBs in 3D using Altium is a lot easier than I thought it would be. Trading 3D PCB layout design files with my mechanical cohorts for review has never been easier!&#;

Kelly Dack, CID+ CIT
PCB Designer / IPC Instructor

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