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Sputtering Targets for Research & Production

Author: Harry

May. 13, 2024

63 0 0

Sputtering Targets for Research & Production

Sputtering targets are essential in various industries, notably in the advancing tech fields where precise, high-quality thin film depositions are required. According to sources from Google, the demand for high-purity sputtering targets has surged due to the proliferation of electrical and optical devices requiring thin-film transistors, solar cells, and various types of sensors. This ongoing demand drives significant advancements and innovations in manufacturing technologies.

The sputtering target market is driven by the global increase in demand and is therefore crucial for developing new technologies in the glass industry. Manufacturers use sintering technology, such as sintered and deeply processed glass, to produce enhanced sputtering targets. Some companies, especially those in the glass manufacturing sector, focus on expanding their coated glass production lines. The market for sputtering products can be categorized into three main segments: glass, glass products, and glass components.

What are Sputtering Targets?

Sputtering targets are thin discs or sheets of material used in the sputtering process to deposit thin films onto substrates like silicon wafers. In sputtering, atoms of the target material are ejected from its surface and deposited onto a substrate by bombarding the target with ions.

Sputtering targets have diverse applications across many fields, including microelectronics, thin-film solar cells, optoelectronics, and decorative coatings.

Applications in Microelectronics

In microelectronics, sputtering targets are used to deposit thin films of materials such as aluminum, copper, and titanium onto silicon wafers for creating electronic devices like transistors, diodes, and integrated circuits.

Applications in Thin-Film Solar Cells

For thin-film solar cells, sputtering targets deposit materials like cadmium telluride, copper indium gallium selenide, and amorphous silicon onto substrates, resulting in high-efficiency solar cells.

Applications in Optoelectronics

Sputtering targets are employed in optoelectronics to deposit thin films of indium tin oxide and aluminum zinc oxide onto substrates, creating transparent conductive coatings for LCD displays and touch screens.

Decorative Coatings

In decorative coatings, sputtering targets are used to deposit thin layers of gold, silver, and chrome onto various substrates, producing aesthetically appealing coatings for automotive parts, jewelry, and other products.

Sputtering Target Materials

Below are some of the sputtering targets that we offer:

Item Specification Quantity
CST-01-Cobalt Sputtering Target Cobalt (Co), Purity: 99.95%, Diameter: 1 inch, Thickness: 0.125 inches 1 No.
AKN-NiFe-Ni80Fe20 Ni80Fe20 sputter target, Purity: 99.95%, Diameter: 2 inches, Thickness: 0.125 inches 1 No.
AKN-NiFe-Oneinch-Ni80Fe20 Ni80Fe20 sputter target, Purity: 99.95%, Diameter: 1 inch, Thickness: 0.125 inches 1 No.
AKN-WS2-WS2 WS2 sputter target, Purity: 99.9%, Diameter: 1 inch, Thickness: 0.125 inches, with Cu backing plate 1 No.
AKN-Gd2O3-Gd2O3 Gd2O3 sputter target, Purity: 99.9%, Diameter: 1 inch, Thickness: 0.125 inches, with Cu backing plate 1 No.

Acetron Product Page

What Are Sputtering Targets Used For?

Sputtering targets are metal objects used in the sputtering process, varying in size from one-inch squares to over a yard in length. Smaller targets are generally less than a centimeter in diameter, while larger sputtering targets are required for some equipment. These targets are segmented into required shapes and sizes for specific applications.

The process involves depositing thin films by PVD, where atoms are ejected from a substrate and collide with the metal target to form a thin film.

Traditionally, sputtering targets are rectangular or circular. However, modern needs have led to the creation of specialized shapes, enhancing precision in thin film deposition. Rotating sputtering targets, shaped like long cylinders, offer greater surface area and faster deposition.

Sputtering targets have diverse applications, such as in vacuum coating equipment for forming precise thin films. The process, called sputtering, involves transferring electrons between atoms using a target specially designed for flexibility and rigidity.

The melting point and conductivity of the target material are critical factors. Some target materials, non-conductive by nature, need to be coated with protective substances.

Using sputtering machines, valuable materials like aluminum can be deposited onto substrates, creating well-defined thin films, a necessary step in advanced manufacturing.

Other applications include producing semiconductors and conducting layers for various electronic components. Ensuring chemical purity and metallurgical uniformity of sputtering targets is essential for these high-precision uses.

Silicon Sputtering Target

A silicon sputtering target is made by sputtering metal from a Si ingot. Preferred embodiments undergo various processes like electroplating, sputtering, and vapor deposition, including additional cleanings and etching to achieve desirable surface conditions. Resulting targets are highly reflective and quick to burn, with films producing low particle counts.

These targets are used to deposit thin films on silicon-based materials for displays, semiconductors, optics, optical communication, and glass coating applications. They are also suitable for etching high-tech components.

Silicon sputtering targets comprise silicon atoms and require precise material quantities for manufacturing components. The sputtering process, however, does not utilize silicon targets alone but often integrates them with other processes for enhanced outcomes.

What is the Optical Or Stress Data for Sputtering Silicon Wafers?

One common question about sputtered Silicon is regarding its optical or stress data. Specific data on diode-sputtered films might be scarce, but it is essential to determine their response to high-stress levels and identify suitable microstructures for various applications.

In general, sputtered silicon exhibits compressive stress, demonstrating enhanced surface diffusion due to high substrate temperatures. However, this enhancement is usually insufficient to fully compensate for kinetic energy differences, offering a guide for optimal deposition conditions.

Working pressures also significantly impact film quality. At lower pressures, amorphous silicon shows low mechanical loss, whereas high temperatures increase mechanical loss. Variations in working pressure alter RMS values, resulting in rougher films with columnar microstructure, aligning with Thornton's structure zone model.

Interested in learning more? Visit our metal sputtering target page for additional details.

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