What is the difference between flip chip and COB?

### What is the difference between flip chip and COB?

#### Flip Chip.

1. **What is flip chip technology?**.

Flip chip technology is a type of semiconductor packaging method where the chip is flipped over and mounted directly onto the substrate with the active side facing down. This offers shorter interconnection lengths, better heat dissipation, and improved electrical performance compared to traditional wire bonding methods.

2. **How does flip chip differ from COB?**.

In flip chip technology, the metallized bumps on the chip are directly attached to matching pads on the substrate using solder bumps or conductive adhesives. This allows for a higher I/O density, reduced parasitic capacitance, and enhanced electrical signal integrity.

#### Chip on Board (COB).

1. **What is COB technology?**.

Chip on Board (COB) technology involves mounting a bare semiconductor chip directly onto a PCB substrate without the use of a package. The chip is then connected using wire bonding or other interconnection methods.

2. **How does COB differ from flip chip?**.

Unlike flip chip technology, COB does not involve flipping the chip before mounting it onto the substrate. This can lead to larger interconnection lengths, reduced I/O density, and potential signal integrity issues compared to flip chip technology.

In summary, the main difference between flip chip and COB lies in the mounting and interconnection methods used. Flip chip technology offers advantages such as shorter interconnection lengths and improved electrical performance, while COB may be more cost-effective but may have limitations in terms of I/O density and signal integrity.

Want more information on led chip manufacturer, buy 300w cob led chip, ir led chip manufacturer? Feel free to contact us.